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For Scientific Research & Industry Modernisation.
Direct Laser Writing (DLW) device is capable of fabricating 3D free-form structures and therefore a promising tool for photonic wire bonding, which requires complex 3D inter-connections and controllable optical quality.
Figure. Photonic wire bonding (PWB) are polymerized by direct laser writing using ultra short laser pulses at a high repetition rate under tight focusing conditions. (Source from: Juodkazis, S. (2020). Laser polymerized photonic wire bonds approach 1 Tbit/s data rates. Light: Science & Applications, 9(1).)
